Philips Stereo Amplifier TDA7056AT User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA7056AT  
3 W mono BTL audio amplifier with  
DC volume control  
1998 Feb 23  
Product specification  
File under Integrated Circuits, IC01  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
BLOCK DIAGRAM  
V
n.c.  
P
1 to 3, 8 to 13,  
16, 18 to 20  
4
+
I + i  
TDA7056AT  
14  
17  
positive output  
5
positive input  
+
7
DC volume control  
I i  
negative output  
+
TEMPERATURE  
PROTECTION  
V
STABILIZER  
ref  
6
15  
MGM576  
signal  
power  
ground ground  
Fig.1 Block diagram.  
1998 Feb 23  
3
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
PINNING  
SYMBOL  
n.c.  
PIN  
DESCRIPTION  
not connected  
1
2
n.c.  
not connected  
not connected  
positive supply voltage  
positive input  
handbook, halfpage  
n.c.  
3
n.c.  
n.c.  
n.c.  
20 n.c.  
1
2
VP  
4
19  
n.c.  
18 n.c.  
17  
VI  
5
3
GND1  
VC  
6
signal ground  
DC volume control  
not connected  
not connected  
not connected  
not connected  
not connected  
not connected  
positive output  
power ground  
not connected  
negative output  
not connected  
not connected  
not connected  
V
P
OUT−  
4
7
V
I
16 n.c.  
5
n.c.  
8
TDA7056AT  
n.c.  
9
GND1  
VC  
6
15 GND2  
n.c.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
OUT+  
7
14  
n.c.  
n.c.  
8
13 n.c.  
n.c.  
n.c.  
n.c.  
n.c.  
9
12  
11  
n.c.  
n.c.  
10  
OUT+  
GND2  
n.c.  
MGM577  
OUT−  
n.c.  
n.c.  
Fig.2 Pin configuration.  
n.c.  
1998 Feb 23  
4
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
The maximum gain of the amplifier is fixed at 35.5 dB.  
The DC volume control stage has a logarithmic control  
characteristic.  
FUNCTIONAL DESCRIPTION  
The TDA7056AT is a mono BTL output amplifier with DC  
volume control. It is designed for use in TVs and monitors  
but is also suitable for battery-fed portable recorders and  
radios.  
The total gain can be controlled from +35.5 to 44 dB.  
If the DC volume control voltage is below 0.3 V, the device  
switches to the mute mode.  
In conventional DC volume circuits the control or input  
stage is AC-coupled to the output stage via external  
capacitors to keep the offset voltage low. In the  
TDA7056AT the DC volume control stage is integrated into  
the input stage so that no coupling capacitors are required.  
With this configuration, a low offset voltage is still  
maintained and the minimum supply voltage remains low.  
The amplifier is short-circuit proof to ground, VP and  
across the load. A thermal protection circuit is also  
implemented. If the crystal temperature rises above  
+150 °C the gain will be reduced, thereby reducing the  
output power. Special attention is given to switch-on and  
switch-off clicks, low HF radiation and a good overall  
stability.  
The BTL principle offers the following advantages:  
Lower peak value of the supply current  
Power dissipation  
The frequency of the ripple on the supply voltage is twice  
the signal frequency.  
Assume VP = 12 V; RL = 16 .  
The maximum sine wave dissipation is 1.8 W.  
Consequently, a reduced power supply with smaller  
capacitors can be used which also results in cost  
reductions. For portable applications there is a trend to  
decrease the supply voltage, resulting in a reduction of  
output power at conventional output stages. Using the BTL  
principle increases the output power.  
The Rth vj-a of the package is 60 K/W.  
Therefore Tamb(max) = 150 60 × 1.8 = 42 °C.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL PARAMETER CONDITIONS  
supply voltage  
MIN.  
MAX.  
18  
UNIT  
VP  
V
V
A
A
V5, 7  
IORM  
IOSM  
Ptot  
Tamb  
Tstg  
Tvj  
input voltage pins 5 and 7  
repetitive peak output current  
non-repetitive peak output current  
total power dissipation  
5
1.25  
1.5  
1.5  
+85  
+150  
150  
1
Tcase < 60 °C  
W
°C  
°C  
°C  
h
operating ambient temperature  
storage temperature  
40  
55  
virtual junction temperature  
short-circuit time  
tsc  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
in free air  
VALUE  
60  
UNIT  
Rth(j-a)  
thermal resistance from junction to ambient  
K/W  
1998 Feb 23  
5
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
CHARACTERISTICS  
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 °C; unless otherwise specified (see Fig.14).  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VP  
supply voltage  
total quiescent current  
4.5  
8
18  
V
Iq(tot)  
RL = ; note 1  
16  
mA  
Maximum gain (V7 = 1.4 V)  
Po  
output power  
THD = 10%; RL = 16 Ω  
Po = 0.5 W  
3
3.5  
0.3  
1
W
THD  
Gv(max)  
Vi(rms)  
total harmonic distortion  
maximum total voltage gain  
input signal handling (RMS value)  
34.5  
%
35.5  
36.5  
dB  
V
VVC = 0.8 V; THD < 1% 0.5  
0.65  
Vn(o)(rms) noise output voltage (RMS value)  
f = 500 kHz; note 2  
at 1 dB  
38  
210  
150  
25  
µV  
kHz  
dB  
mV  
kΩ  
B
bandwidth  
0.02 to 300  
SVRR  
VOS  
Zi  
supply voltage ripple rejection  
DC output offset voltage  
input impedance (pin 3)  
note 3  
46  
0
V17 v14  
15  
20  
Minimum gain (V7 = 0.5 V)  
Gv voltage gain  
44  
20  
30  
dB  
Vo(n)(rms) noise output voltage (RMS value)  
note 4  
µV  
Mute position  
Vo(mute)  
output voltage in mute position  
VVC 0.3 V;  
VI = 600 mV; note 4  
35  
45  
µV  
DC volume control  
Gv  
IVC  
voltage gain control range  
control current  
75  
60  
80  
70  
80  
dB  
VVC = 0 V  
µA  
Notes  
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being  
equal to the DC output offset voltage divided by RL.  
2. The noise output voltage (Vn(o)(rms)) at f = 500 kHz, is measured with Rs = 0 and B = 5 kHz.  
3. The ripple rejection is measured with Rs = 0 and f = 100 Hz to 10 kHz. The ripple voltage (Vripple = 200 mV RMS)  
is applied to the positive supply rail.  
4. The noise output voltage (Vn(o)(rms)) is measured with Rs = 5 kunweighted.  
1998 Feb 23  
6
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
MGM578  
MGM579  
20  
12  
handbook, halfpage  
handbook, halfpage  
I
THD  
(%)  
10  
q
(mA)  
16  
8
6
4
2
0
12  
8
4
(1)  
0
1  
0
4
8
12  
16  
20  
10  
1
10  
P
(W)  
o
V
(V)  
P
V5 = 1.4 V; no load.  
VDC = 1.4 V.  
(1) VP = 12 V; RL = 16 .  
Fig.3 Quiescent current as a function of the  
supply voltage.  
Fig.4 THD as a function of output power.  
MGM580  
MGM581  
8
100  
handbook, halfpage  
handbook, halfpage  
RR  
(dB)  
THD  
(%)  
80  
60  
40  
20  
6
4
2
(1)  
(2)  
(3)  
(1)  
0
10  
0
10  
2
3
4
5
2
3
4
5
10  
10  
10  
10  
10  
10  
10  
10  
f (Hz)  
f (Hz)  
VP = 12 V; RL = 16 ; Vr = 200 mV.  
(1) V7 = 0.3 V; Rs = 5 k.  
(2) V7 = 1.4 V; Rs = 0 .  
VP = 12 V, Po = 0.5 W, VDC = 1.4 V.  
(1) RL = 16 .  
(3) V7 = 1.4 V; Rs = 5 k.  
Fig.5 THD as a function of frequency.  
Fig.6 Ripple rejection as a function of frequency.  
1998 Feb 23  
7
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
MGM583  
MGM582  
1000  
40  
handbook, halfpage  
gain  
handbook, halfpage  
V
n
(dB)  
(µV)  
20  
800  
0
20  
40  
60  
80  
600  
400  
200  
0
0
0.4  
0.8  
1.2  
1.6  
2.0  
0
0.4  
0.8  
1.2  
1.6  
2.0  
V
(V)  
V
(V)  
7
7
Measured with Rs = 5 kunweighted; f = 22 Hz to 22 kHz.  
Fig.7 Gain control as a function of DC volume  
control.  
Fig.8 Noise output voltage as a function of DC  
volume control.  
MGM585  
MGM584  
5
1000  
handbook, halfpage  
handbook, halfpage  
P
V
o
i
(W)  
4
(mV)  
800  
3
600  
400  
200  
0
(1) (2) (3)  
2
1
0
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
V
(V)  
V
(V)  
P
P
Measured at THD = 10%. The maximum output power is limited by  
the maximum power dissipation and the maximum available output  
current.  
(1) RL = 8 .  
(2)  
RL = 16 .  
Tamb = 25 °C; THD = 1%; RL = 16 ; VDC = 0.8 V.  
(3) RL = 25 .  
Fig.9 Input signal handling as a function of the  
supply voltage.  
Fig.10 Output power as a function of the supply  
voltage.  
1998 Feb 23  
8
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
MGM586  
MGM587  
3
100  
handbook, halfpage  
handbook, halfpage  
I
5
(µA)  
P
(W)  
60  
2
20  
20  
60  
(1)  
(2)  
(3)  
1
0
100  
0
0.4  
0.8  
1.2  
1.6  
2.0  
0
4
8
12  
16  
20  
V
(V)  
V
(V)  
P
7
(1) RL = 8 .  
(2) RL = 16 .  
(3) RL = 25 .  
Fig.11 Total worst case power dissipation as a  
function of supply voltage.  
Fig.12 Control current as a function of DC volume  
control.  
1998 Feb 23  
9
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
a. Top view of bottom copper.  
GND  
+V  
P
220 µF  
100 nF  
0.47 µF  
IN  
20  
1
OUT  
5 kΩ  
TDA7056A/BT  
100  
nF  
+OUT  
D&A AUDIO POWER  
CIC NIJMEGEN  
volume  
MGM591  
b. Top view of component side.  
Fig.13 Printed-circuit board layout.  
10  
1998 Feb 23  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
TEST AND APPLICATION INFORMATION  
Test conditions  
Thermal behaviour:  
The measured thermal resistance of the IC package is  
highly dependent on the configuration and size of the  
application board. Data may not be comparable between  
different semiconductors manufacturers because the  
application boards and test methods are not (yet)  
standardized. The thermal performance of packages for a  
specific application may also be different than presented  
here, because the configuration of the application boards  
(copper area) may be different. Philips Semiconductors  
uses FR-4 type application boards with 1 oz copper traces  
with solder coating. The measurements have been carried  
out with vertical placed boards.  
T
amb = 25 °C if not specified: VP = 12 V; VDC = 1.4 V;  
f = 1 kHz; RL = 16 ; audio bandpass: 22 Hz to 22 kHz.  
In Figures 5 and 6 a low-pass filter of 80 kHz was applied.  
It should be noted that capacitive loads (100 pF and 5 nF)  
connected between the output pins to a common ground  
can cause oscillations. The BTL application circuit diagram  
is shown in Fig.14. To avoid instabilities and too high  
distortion, the input and power ground traces must be  
separated as far as possible and connected together as  
close as possible to the IC. The quiescent current has  
been measured without load impedance.  
Using a practical PCB layout with wider copper tracks and  
some copper area to the IC pins and just under the IC, the  
thermal resistance from junction to ambient can be  
reduced. In the demonstration application PCB the  
Rth(j-a) = 56 K/W for the SO20 plastic package. For a  
maximum ambient temperature of Tamb = 50 °C the  
following calculation can be made for the maximum power  
Voltage gain  
The maximum closed-loop voltage gain has been  
internally fixed at 35.5 dB. The input sensitivity at  
maximum gain for Po = 3 W (RL = 16 ) is 115 mV.  
The gain bandwidth is 20 Hz to 300 kHz within 1 dB.  
(150 K/W 50 K/W)  
dissipation:  
= 1.79 W  
------------------------------------------------------  
Output power  
56 K/W  
The output power as a function of supply voltage has been  
measured at THD = 10%. The maximum output power is  
limited by the maximum allowed power dissipation at  
For the application at VP = 12 V and RL = 16 the worst  
case sine wave dissipation is 1.85 W. Because in practice  
the ‘music-power’ causes about the half of the sine wave  
dissipation, this application (VP = 12 V; RL = 16 ) has  
Tamb = 25 °C approximately 2 W, and the maximum  
available output current is 1.25 A repetitive peak current.  
been allowed.  
Switch-on/switch-off  
Short-circuit protection:  
The switch-on behaviour depends on the following:  
The output pins (pins 14 and 17) can be short-circuited to  
ground respectively to +VP. The Missing Current Limiter  
(MCL) protection circuit will shut-off the amplifier.  
Removing the short-circuit will reset the amplifier  
automatically. Short-circuit across the load  
The rise time of the power supply (if tr > 40 ms for  
VP = 0 to 12 V then the switch-on behaviour will be  
good)  
The input capacitor and source impedance (a higher  
source impedance and/or lower input capacitor value  
will have a positive influence on the switch-on/switch-off  
behaviour)  
(pins 14 and 17) will activate the thermal protection circuit;  
this will result in reducing the short-circuit current.  
The DC volume control pin (a capacitor of >0.1 µF  
avoids disturbances).  
1998 Feb 23  
11  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
V
P
(1)  
100 nF  
220 µF  
n.c.  
1 to 3, 8 to 13,  
16, 18 to 20  
4
+
I + i  
TDA7056AT  
14  
17  
0.47 µF  
5
positive input  
+
7
R
= 16 Ω  
L
I i  
+
STABILIZER  
TEMPERATURE  
PROTECTION  
5
kΩ  
R
s
V
ref  
DC  
volume  
control  
6
15  
MGM588  
ground  
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as  
possible to the IC.  
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2.  
Fig.14 Test and application diagram.  
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit  
protection (MLC) will be activated.  
1998 Feb 23  
12  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
V
= 12 V  
handbook, halfpage  
P
handbook, halfpage  
82 kΩ  
volume  
control  
7
TDA7056AT  
7
TDA7056AT  
1 µF  
1 µF  
100 kΩ  
22 kΩ  
GND  
GND  
MGM589  
volume  
control  
MGM590  
Fig.15 Application with potentiometer as volume  
control; maximum gain = 30 dB.  
Fig.16 Application with potentiometer as volume  
control; maximum gain = 36 dB.  
1998 Feb 23  
13  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
PACKAGE OUTLINE  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
0.25  
0.01  
1.27  
0.050  
1.4  
0.25 0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-24  
97-05-22  
SOT163-1  
075E04  
MS-013AC  
1998 Feb 23  
14  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
SOLDERING  
Introduction  
Wave soldering  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream end.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SO  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
1998 Feb 23  
15  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1998 Feb 23  
16  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
NOTES  
1998 Feb 23  
17  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
NOTES  
1998 Feb 23  
18  
 
Philips Semiconductors  
Product specification  
3 W mono BTL audio amplifier with DC  
volume control  
TDA7056AT  
NOTES  
1998 Feb 23  
19  
 
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Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,  
Fax. +43 160 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Slovakia: see Austria  
Czech Republic: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 0044  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580920  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 488 3263  
Hungary: see Austria  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Indonesia: see Singapore  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
Uruguay: see South America  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Vietnam: see Singapore  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors,  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1998  
SCA57  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
545102/25/01/pp20  
Date of release: 1998 Feb 23  
Document order number: 9397 750 03253  
 

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